The thermal conductivity of an adhesive / die-attach is a critical parameter for design engineers, especially as components continue to shrink and more and more are packed into a given area. However, the reported “bulk” thermal conductivity of a material can be misleading, particularly because this value neglects the effects of interfacial resistance in a real packaging application.

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At Creative Electron, our TLPS materials are designed to establish metallurgical connections with solderable surfaces, thereby significantly reducing the interfacial thermal resistance associated with conventional conductive adhesives. As a result, the “effective” thermal conductivity is much closer to that of solders than conductive adhesives.

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For more information, including data sheets and MSDS, please click here.