Sensor Arrays
Sensor arrays often require bonding to a chip or to a printed circuit board by means of conductive bumps, such as solder. The sensor assembly shown below was fabricated by bump bonding the various components surrounding it. Counter clockwise from the assembly, first is the interposer card with solder bumps on one side and wire bond pads on the other for attaching a sensor readout chip. The underside of the sensor, with its gold solder pad array, is shown clockwise from the assembly.