TLPS formulation “ATLF61” is a low-viscosity, solvent-free and high-temperature stable SnBi-based transient liquid phase sintering adhesive with excellent thermal and electrical properties, 7 W/m-K and 75μΩ-cm, respectively. Developed under Department of Energy Phase I SBIRs, the material has been qualified for assembly of QFN plastic packages per IPC/JEDEC specifications. The material is also qualified for use in space-electronics due to its negligible outgassing properties per ASTM E-595. ATLF61 is particularly suited for the replacement of silver-filled conductive adhesives is the assembly/packaging of RoHS compliant electronics.
The ATLF61 is available in 100g Engineering Lots and can be packaged in 3cc, 5cc, or 10cc syringes.
For larger orders and pricing information please contact info@creativeelectron.com
The ATLF61 is available in 100g Engineering Lots and can be packaged in 3cc, 5cc, or 10cc syringes.
For larger orders and pricing information please contact info@creativeelectron.com