TLPS formulation “CELF108” is a low-viscosity, solvent-free and high-temperature stable SnBi-based transient liquid phase sintering adhesive with excellent thermal and electrical properties, 10 W/m-K and 60μΩ-cm, respectively. Developed under an ongoing NSF Phase II SBIR project, the material has been specifically designed for high-volume SMT manufacturing and shows no increase in viscosity after 24hrs at room temperature. CELF108 is particularly suited for the replacement of silver-filled conductive adhesives for semiconductor packaging and is also a candidate material for the replacement of AuSn solder in the assembly of high-brightness light emitting diodes (HB-LEDs) and high-power amplifiers for RF applications.
The CELF108 is available in 100g Engineering Lots and can be packaged in 3cc, 5cc, or 10cc syringes.
For larger orders and pricing information please contact info@creativeelectron.com
The CELF108 is available in 100g Engineering Lots and can be packaged in 3cc, 5cc, or 10cc syringes.
For larger orders and pricing information please contact info@creativeelectron.com