TLPS formulation “CELV310” is a low-viscosity, solvent-free and easily reworkable SnPb-based transient liquid phase sintering adhesive with extremely high effective thermal conductivity in a bondline, in excess of 35 W/m-K. Developed under Navy and MDA Phase II SBIR programs, the material is qualified for the packaging of high power amplifiers in Navy radar systems per MIL-STD 883. CELV310 is particularly suited for the replacement of AuSn solder and/or silver-filled conductive adhesives in the assembly of military electronics.
The CELV310 is available in 100g Engineering Lots and can be packaged in 3cc, 5cc, or 10cc syringes.
For larger orders and pricing information please contact info@creativeelectron.com
The CELV310 is available in 100g Engineering Lots and can be packaged in 3cc, 5cc, or 10cc syringes.
For larger orders and pricing information please contact info@creativeelectron.com