We are so committed to our customers' success that if current technology doesn't meet their needs then we will invent a new process or technology that does! As a result, Creative Electron has become a leading innovator in flip chip bonding, wafer level packaging, and conductive adhesives and a variety of other microelectronic fabrication and signal processing innovations.
Creative Electron has developed and acquired an extensive portfolio of patented intellectual property related to the fabrication of flip chips and flip chip assemblies. We are always looking for faster, less-costly, more reliable processes and materials. Oftentimes, this means that we must invent them ourselves! Our research and development program has experienced unprecedented success in this area, generating patents in wafer-level packaging, no-flow underfill, pre-applied underfills, reworkable underfills and laser flip chip fabrication, as well as intellectual property related to conductive adhesives, paints, and inks.
High Performance Resins for Microvias
US Patent 6,616,984
A formula for the creation of a new high-temperature polymer that combines the best characteristics of epoxies and cyanate esters by using bismaleimides. The resin is ideally suited for printed circuits employing laser-drilled microvias.
Conductive adhesives, inks and paints
US Patent 6,132,646
A formula for the creation of an improved transient liquid phase sintered (TLPS) conductive adhesive. Instead of employing a curing agent with fluxing properties, the curing components are distinct from the fluxing components. This allows the fluxing to occur more completely and without interference from the polymerization reactions.
Wafer-Level and Flip Chip Patents
US Patent 6,774,493
A two-step electronic assembly process whereby a flip chip is soldered to a substrate with a pre-applied underfill. The step-one underfill has a low coefficient of thermal expansion and the step-two underfill contains a polymer flux that has a high coefficient of thermal expansion. The two portions can also be intermixed and inter-reacted.
US Patent 6,566,234
A method for making an underfilled flip chip assembly using a pre-applied underfill.
- An encapsulant is applied, which may contain a silica powder-filled polymer, to at least a portion of a bumped flip chip
- A second encapsulant is then applied, which contains a curable fluxing agent between the encapsulated chip and a printed circuit.
- The encapsulated chip is then placed on the printed circuit substrate so that a thin layer of second portion encapsulant is present between the solder bumps and the printed circuit substrate.
- The combination is then heated to melt the solder and harden the polymers.
US Patent 6,518,677
A solder-bumped flip chip with a pre-coated underfill. For improved reliability, the underfill can include a mixture of a polymer and an inorganic filler. The underfill can also contain at least one meltable portion, which provides for easy rework. When used with an adhesive having fluxing properties, this unique invention allows simultaneous flip chip soldering and underfill curing in a reworkable structure.
US Patent 6,399,426
A method for making an underfilled flip chip assembly using a pre-applied underfill.
- An encapsulant is applied to a solder-bumped flip chip while exposing the tips of the solder bumps.
- A polymer with fluxing properties is then applied either to the encapsulated chip or to a printed circuit.
- The encapsulated chip is placed on the printed circuit.
- The combination is heated to melt the solder bumps and simultaneously harden the polymer.
US Patent 6,335,571
Electronic assembly process whereby a flip chip with a multipart pre-applied underfill is soldered to a printed circuit. The first portion of the underfill has a low coefficient of thermal expansion and a second portion, comprising a polymer flux, has a high coefficient of thermal expansion. The underfill may also include materials that allow rework of the flip chip assembly.
US Patent 6,297,560
Fabrication process that allows one to solder a flip chip to a printed circuit using a pre-applied, two-part underfill. The underfill comprises a laminated film and an adhesive with fluxing properties. The underfill can also include a printed circuit, as well as materials that allow rework of the flip chip assembly.
US Patent 6,121,689
Fabrication process whereby a flip-chip can be soldered to a substrate containing a pre-applied underfill. The underfill contains a layer of adhesive with fluxing properties between the encapsulant and the substrate, which may include materials that allow rework of the flip chip assembly.
No-Flow Underfills
US Patent 6,017,634
Provides a formula for making an improved no-flow underfill polymer using acrylic acid and other similar addition polymers
US Patent 5,985,456
Provides a simpler formula for making an improved no-flow underfill polymer using principally acrylates or other addition polymers.
US Patent 5,985,043
A formula for making an improved no-flow underfill polymer using acrylates or other addition polymers.
